Schematic illustration of an edge computing system based on monolithic 3D-integrated, 2D material-based electronics. The system stacks different functional layers, including AI computing layers, ...

Silicon chip manufacturers like Intel and TSMC are constantly outdoing themselves to make ever smaller features, but they are getting closer to the physical limits of silicon. “We already have very, ...

Physicists have developed a novel approach to maintain special quantum characteristics, even in 3D materials, with potential applications in optical systems and advanced computing. There is a big ...

Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for ...